Wired Wafer Temperature Measurement System
Overview
Wafer wired temperature measurement system is used to monitor temperature changes in the production process of cutting-edge products. It captures the influence of etching process and environment on wafer, provides direct and real-time temperature measurement during every critical step in chip manufacturing.
Features
a.High accuracy, flexible application, fast measurement；
b.Scanning speed up to 10Hz, temperature accuracy up to 1mK;
c.Wired communication.
Parameters
Product size | Length 202mm* width 214mm* height 65mm (three layers) |
Power supply | 220V AC |
Temperature measurement range | -70℃～1000℃ |
Temperature accuracy | 1mk（3σ） |
Accuracy of repeated measurement | ＜0.3mK（3σ） |
Number of sensors | 36 |
Measurement Frequency | max.10Hz
|
Sensor response time | ≤1s
|
Communication interface | LAN |
Warranty Period | 1year |
Delivering Growth – in Asia and Beyond.
Hu ICP Bei No. 2023002235
