Wafer High-temp Wireless Temperature Measurement System
Overview
Wafer high-temp wireless temperature measurement system are designed to optimize and monitor advanced thin film processes (FEOL and BEOLALD, CVD and PVD), RTP rapid annealing, and other high temperature processes.Wafer high-temp wireless Temperature measurement systems measure the thermal uniformity of process equipment and provide temporal and spatial temperature data collected under real-world production process conditions.Wafer high-temp wireless temperature measurement systems provide in-situ, real-time temperature data to help IC manufacturers accurately debug process equipment to improve yields and productivity.
Features
a.High accuracy, flexible application, fast measurement;
b.Scanning speed up to 4Hz, temperature accuracy up to ±0.2℃ ;
c.Wireless communication.
Dimensions | Wafer diameter 300mm (12 inches) ±0.2mm, thickness ≤6mm |
Power supply | Battery |
Temperature measurement range | 0℃~850℃ |
Temperature accuracy | ±0.2℃ |
Accuracy of repeated measurement | <0.1℃ |
Number of sensors | 21 |
Measurement Frequency | max.4Hz |
Sensor Response Time | ≤1s |
communication interface | WiFi |
Continuous Working Time | 0℃~850℃,7minutes 0℃~650℃,15minutes |
Base materia | Si |
Warranty Period | 1year |
Delivering Growth – in Asia and Beyond.