
From September 10 to 11, 2026, the 10th International Workshop on Advanced Patterning Solutions (IWAPS) was grandly held at the Shenzhen World Exhibition & Convention Center. Focusing on frontier processes for advanced nodes, the workshop brought together renowned experts, scholars, and enterprise representatives from semiconductor manufacturing, equipment, materials, and related fields around the world to explore the path of technology evolution.

Image source: IICIE International Integrated Circuit Innovation Expo
At this exhibition, JHEAT was honored to be invited and presented a research poster on site. Earlier, JHEAT’s submitted paper, “Development of Wireless In-situ Scanner Temperature Wafer with Temperature Stability Superior to 1 mK,” stood out in the call-for-paper review of the 10th International Workshop on Advanced Patterning Solutions and was selected for the conference proceedings. The poster highlighted the paper’s innovative design and research achievements, whose forward-looking vision and practical value received wide acclaim from industry professionals. This selection represents the review experts’ recognition of JHEAT’s R&D capabilities in high-precision temperature measurement and control.
During the event, the JHEAT team participated in the agenda of the 10th IWAPS, attentively listening to keynote reports by domestic and international experts and scholars on advanced process technology, equipment, and materials innovation, while keeping abreast of frontier dynamics and industry trends.
Meanwhile, JHEAT’s booth welcomed numerous industry professionals. Domestic and overseas customers showed strong interest in the company’s μK-level ultra-high-precision temperature measurement technology and expressed their intention for follow-up technical exchanges.

This appearance at the 10th IWAPS served as both a concentrated review of JHEAT’s technical foundation and an authoritative recognition of its R&D achievements. In the future, JHEAT will continue to deepen its expertise in ultra-high-precision temperature measurement and control technology, join hands with industry partners, measure the “invisible temperature” more accurately and control it more steadily, and contribute solid strength to the high-quality development of the semiconductor industry!


Hu ICP Bei No. 2023002235