
Wired Pressure Sensing Wafer System
Overview
The Wired Pressure Sensing Wafer System consists of a wired pressure sensing wafer, a data acquisition unit, and software. It accurately measures the pressure distribution and pressure response on the wafer surface, making it suitable for wafer pressure testing across multiple application scenarios. This system delivers both high precision and practical usability.
Features
a.It offers a wide measurement range, with non-linearity better than 0.1% FS, and a fast response time;
b.High stability, over-pressure resistance, and compatibility with both vacuum and atmosphere environments, and etc ;
c.Fast sampling speed and high accuracy;
d.Supports data storage and export (xlsx/csv) with easy and intuitive operation.

Delivering Growth – in Asia and Beyond.
Hu ICP Bei No. 2023002235