From September 23 to 27, 2025, the 25th China International Industry Fair will be grandly held at the National Exhibition and Convention Center (Shanghai). This edition of the fair will feature nine specialized exhibition zones covering CNC machine tools, industrial automation, robotics, green and low-carbon technologies, smart energy, new materials, and more. The event also featured multiple high-level forums and activities, including the “Intelligent Mobility Without Borders: Driving the Future 2025 China Autonomous Driving Industry Innovation and Ecosystem Forum,” the “2025 (14th) Global Automation and Manufacturing Summit,” and the “Automotive/Industrial Chip Special Session and Matchmaking Event.” These initiatives established a vital platform for industry exchange and collaborative growth.
CIIF 2025
On this international stage, JHEAT joined forces with the Jiading District Integrated Circuit Industry Chain Alliance and the Shanghai Intelligent Sensor Industrial Park to showcase our innovative achievements in the semiconductor field, including temperature measurement systems and domestically produced high-precision temperature measurement and control instruments. The diverse product lineup demonstrated the company's technical prowess and application capabilities in ultra-high-precision temperature measurement and control. During the exhibition, leaders from the Jiading Industrial Zone Group visited the Jieru booth for in-depth discussions with our team. They expressed high recognition for Jieru's proactive exploration in advancing domestic substitution and fostering collaborative development within the industrial chain.
In the future, JHEAT will continue to drive innovation through independent R&D, foster industry collaboration as a key link, and leverage the international platform of the China International Industry Fair to deepen exchanges and cooperation with upstream and downstream partners in the industrial chain. Together, we will contribute to the high-quality development of China's intelligent manufacturing and semiconductor industries!
Hu ICP Bei No. 2023002235
