Etch Temp System
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Etch Temp System
Overview
The Etch Temp System(in 300mm configuration), captures the effects of the plasma etch process environment on production wafers under real process conditions. This system includes high sensor density enabling across-wafer temperature monitoring that strongly correlates with CD uniformity control for conductor etch applications. By characterizing thermal conditions that closely represent product wafer conditions, this wireless wafer assists process engineers with tuning the etch process conditions, and the qualification, matching of the front end plasma etch chambers, and verification in the backend of the production line.
Features
a.The Etch Temp System(in 300mm configuration), captures the effects of the plasma etch process environment on production wafers under real process conditions.
b.By characterizing the thermal state of wafers that closely mimics the actual product wafers, this wireless wafer assists process engineers with tuning the etch process conditions, and the qualification, matching of the front end plasma etch chambers, and verification in the post-preventive maintenance.
Delivering Growth – in Asia and Beyond.
Hu ICP Bei No. 2023002235
